BU52003GUL-E2【PDF 17/22 页】IC HALL EFFECT SW BIPO VCSP50L1

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Sheet目录60

13页 14页 15页 16页 [17页]18页 19页 20页 21页

BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV

Technical Note

17/19

www.rohm.com

2010.08 - Rev.C

螼peration Notes

1) Absolute maximum ratings

Exceeding the absolute maximum ratings for supply voltage, operating conditions, etc. may result in damage to or

destruction of the IC. Because the source (short mode or open mode) cannot be identified if the device is damaged in this

way, it is important to take physical safety measures such as fusing when implementing any special mode that operates in

excess of absolute rating limits.

2) GND voltage

Make sure that the GND terminal potential is maintained at the minimum in any operating state, and is always kept lower

than the potential of all other pins.

3) Thermal design

Use a thermal design that allows for sufficient margin in light of the power dissipation (Pd) in actual operating conditions.

4) Pin shorts and mounting errors

Use caution when positioning the IC for mounting on printed circuit boards. Mounting errors, such as improper positioning

or orientation, may damage or destroy the device. The IC may also be damaged or destroyed if output pins are shorted

together, or if shorts occur between the output pin and supply pin or GND.

5) Positioning components in proximity to the Hall IC and magnet

Positioning magnetic components in close proximity to the Hall IC or magnet may alter the magnetic field, and therefore

the magnetic detection operation. Thus, placing magnetic components near the Hall IC and magnet should be avoided in

the design if possible. However, where there is no alternative to employing such a design, be sure to thoroughly test and

evaluate performance with the magnetic component(s) in place to verify normal operation before implementing the design.

6) Operation in strong electromagnetic fields

Exercise extreme caution about using the device in the presence of a strong electromagnetic field, as such use may cause

the IC to malfunction.

7) Common impedance

Make sure that the power supply and GND wiring limits common impedance to the extent possible by, for example,

employing short, thick supply and ground lines. Also, take measures to minimize ripple such as using an inductor or

capacitor.

8) GND wiring pattern

When both a small-signal GND and high-current GND are provided, single-point grounding at the reference point of the set

PCB is recommended, in order to separate the small-signal and high-current patterns, and to ensure that voltage changes

due to the wiring resistance and high current do not cause any voltage fluctuation in the small-signal GND. In the same

way, care must also be taken to avoid wiring pattern fluctuations in the GND wiring pattern of external components.

9) Exposure to strong light

Exposure to halogen lamps, UV and other strong light sources may cause the IC to malfunction. If the IC is subject to such

exposure, provide a shield or take other measures to protect it from the light. In testing, exposure to white LED and

fluorescent light sources was shown to have no significant effect on the IC.

10) Power source design

Since the IC performs intermittent operation, it has peak current when its ON. Please taking that into account and under

examine adequate evaluations when designing the power source.

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